Two or more packages are installed atop each other ie. Lm35 v s r1 v out tv s lm35 v s 4 v to 20 v output 0 mv 100 mv0c product folder order now technical documents tools software support community an important notice at the end of this data sheet addresses availability warranty changes use in safety critical applications.
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Package on package pop is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array bga packages.
Transistor outline package. This allows higher component density in devices such as mobile phones personal digital assistants pda and digital cameras. Stacked with a standard interface to route signals between them.
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